CleaningWe Help Reduce Your Cost of Ownership

Recycled chamber parts are critical to lowering chamber maintenance costs, but they must meet near new-part contamination requirements. While new-part cleaning primarily removes manufacturing residues, recycled parts require damage-free removal of deposited films to control contamination. Inconsistency in part cleanliness can increase downtime and impact process stability.

Uhp Parts Cleaning With Analytical Validation Improves Chamber Recovery, Reduces Tool Downtime & Increases Mtbc.

Ultra-Clean Parts

UHP Parts Cleaning with Analytical Validation Improves Chamber Recovery, Reduces Tool Downtime, & Increases MTBC


UCT provides ultra-high-purity (UHP) cleaning and coatings for both new and recycled chamber hardware, supporting critical wafer-fab processes including ALD, CVD, etch, diffusion, and PVD.

Key capabilities include:

  • ALD: selective deposition removal, large/heavy-part handling, and analytical validation (e.g., ICP-MS, IC)
  • CVD: showerhead cleaning expertise and automated optical hole inspection
  • Etch: minimally abrasive/non-contact cleaning, plasma re-coating options, and advanced quartz cleaning recipes
  • PVD: environmentally safer deposit/coating removal (e.g. TWAS/deposit removal) and proprietary coatings such as C-Coat to improve performance and extend part life

Customer outcomes:

  • Faster chamber recovery and more predictable start-up
  • Longer MTBC 
  • Extended part life
  • Faster turnaround and lower inventory costs

What differentiates UCT is depth across both recycled fab parts and new-part UHP cleaning for OEM/OPM supply chains—delivering consistent, verified cleanliness at scale.

EcoCopper™ Clean is environmentally safe and extends kit life.

Copper remains the workhorse metallization material across many interconnect levels, even as alternative metals are evaluated for critical layers, keeping copper,and the recurring need to clean and refurbish copper-coated PVD kit hardware,central to high-volume manufacturing.

Traditional methods for removing copper deposition, such as nitric acid (HNO₃) stripping, generate hazardous NOx fumes and can damage aluminum substrates. This reduces part life and poses environmental risks.

EcoCopper™ Clean offers a safer alternative for PVD copper kits. Our process eliminates NOx emissions and preserves substrate integrity, making it both environmentally responsible, non-destructive, and effective.

With EcoCopper™ Clean, customers enjoy extended kit life and a safer work environment.

Infinity Clean extends HiK kit life, reducing cost of ownership.

As advanced nodes add more high-k dielectric ALD layers, there is an increased need to process kits from a larger build-up of film, which must be removed without compromising the chamber parts.

Removing dense high-k films from ALD kits is challenging. Conventional bead blasting can damage Ti/SS substrates, reducing part longevity and increasing cost of ownership.

Infinity Clean™ is engineered to remove HiK (HfO₂ + Al₂O₃) deposition with minimal impact to the underlying substrate. This process preserves part integrity and extends usable life.

Customers observe imperceptible substrate impact and receive significantly longer part life compared to traditional cleaning.

SmartEtch enables up to 10 times more cleans before part recoating.

Industry-standard cleaning processes often damage coatings, generate particles, and increase PM time due to variability in outgassing performance. This can drive frequent part recoating and result in higher operating costs.

UCT’s SmartEtch clean removes deposited materials, minimizing coating impact and maximizing part life. Depending on coating type, parts can be cleaned up to 10 times before recoating is needed. When coating thickness reduction reaches replacement thresholds, UCT can strip and recoat the part to further extend its life.

EnCP is environmentally safe and extends the life of PVD kits.

PVD kits accumulate metallic and compound build-up from the sputter process, requiring periodic cleaning to control defects (particles), maintain film performance, and keep tools running at high uptime.

Repeated chemical cleaning attacks part surfaces and creates byproducts which must be remediated, increasing the environmental impact. EnCP uses high-pressure water to remove deposition on PVD kits, providing a safe and effective alternative, with recoverable byproduct materials.

Combined with C-Coat, EnCP significantly increases MTBC and extends part life. Customers benefit from longer-lasting kits and environmentally safe operations.