Over 20 years ago, UCT Service Division recognized this omission. And, not only developed QuantumClean processes to offer ultra-high purity (UHP) cleaning; but, continues to evolve techniques as nodes get smaller and smaller.

We spotted that there was a missing piece to the puzzle as every other semiconductor process input is ultra-pure and validated with a Certificate of Analysis (COA)─and now even new parts from the OEM.

As a result, we were the first and continue to be the leader in offering UHP chamber parts validated analytically with a COA.

The result for you? Chambers start-up faster. You are back in production sooner. Chambers run more consistently to target.

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As the worldwide leader in ultra-high purity (UHP) semiconductor chamber tool parts cleaning and coatings, UCT Services Division understands the stringent cleaning and micro-contamination specifications of new and recycled parts and provides solutions that improve your process performance and lower your overall cost-of-ownership.

Therefore, we focus on the most critical process areas of wafer fabrication—ALD, CVD, etch, diffusion, PVD.

For ALD, we offer proprietary chemistry that selectively removes deposition, specialized facilities capabilities for large and heavy parts and the employment of ICP-MS and IC analysis techniques. In addition, we have extensive showerhead cleaning expertise and automated optical hole inspection for CVD. Our expertise in etch tool kit cleaning offers minimally abrasive and non-contact processes, plasma re-coating surfaces and coating superior to OEM films and quartz clean recipes that make the quartz less susceptible to process etch. We have more quartz, silicon carbide and silicon diffusion parts handling processes, equipment and protocols than all our competitors combined. We developed a QuantumClean Environmentally Clean Process for you that eliminates the use of chemicals for Twin Wire Arc Spray (TWAS)/deposit removal. In addition, we offer C-Coat, a proprietary coating that obtains superior performance over traditional TWAS coating on PVD parts.

The benefits of using UCT Services Division analytically validated ultra-clean part cleaning and coating processes are FASTER chamber recovery, LONGER mean time between cleans, EXTENDED part life, MORE PREDICTABLE chamber start-up and operation and FAST part turnaround times resulting in REDUCED inventory costs.

In addition, most of our competitors only offer recycle chamber parts cleaning. However, we have vast experience in not only process contaminated parts from wafer fabs ("recycled" parts); but, in UHP cleaning of new parts for OEMs and OPMs.

UCT has a portfolio of QuantumClean advanced coatings for semiconductor processes that can be tailored to the requirements of our customers. This portfolio of coating material, techniques and knowledge allows us to custom design solutions that balance performance with costs.

To maintain a clean process environment, PVD chambers require adhesion of excess sputtered material to exposed part surfaces. Greater adherence means thicker films can accumulate on the part surface; therefore, reducing the PM frequency. Since residual stress depends on the material (e.g. Ti, TiN, W), optimization of the coating is critical. Arc spray technology enables application of aluminum and other metal/alloy coatings to the part substrate delivering a barrier layer with the required surface roughness for the deposited material to adhere. To reduce the recycle loop turnaround time, QuantumClean’s Environmentally Clean Process (ECP) removes the deposition and existing coating in an environmentally safe manner while closely maintaining the part dimension. ECP cleaning extends the part lifetime, lowering the overall COO.

In addition, the halogen-containing plasmas in etch not only pattern the wafer, they react with chamber parts. To increase part lifetimes and reduce particles, our advanced coatings are being used to provide more uniform and higher quality coatings. Chambers utilizing coated parts have higher uptime and wafer output. Traditionally, the industry used yttria (Y2O3) to protect plasma-exposed part surfaces; however, newer coatings improve barrier performance and reduce the post-PM chamber seasoning and qualification time. QuantumClean’s advanced coating technology uses proprietary applications and the most advanced thermal spray technology.

All the coatings are done with our computer-controlled robots and monitored via SPC parameters to ensure specifications are consistently met. Our knowledgeable engineering team can customize a coating solution for your company as we continue to pursue new technologies and materials to enhance performance.

Partnering with UCT for QuantumClean advanced coatings can improve your COO.

With the largest global footprint in the industry, we are located wherever you are in the world. 14 Services Division ultra-high purity parts cleaning, coating and refurbishment locations. 8 semiconductor manufacturing regions. 7 ChemTrace analytical testing laboratories.

With world-wide industry support, copy exact process transfers ensure that you get the same UHP process at Advanced Technology Cleaning Centers and ChemTrace analytical testing laboratories throughout the world.

UCT is the only semiconductor parts cleaning and coating company supported by a fully accredited in-house analytical laboratory business ─ ChemTrace. And, the only one that can deliver UHP semiconductor process chamber tool parts for your company verified by a Certificate of Analysis.

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