As the worldwide leader in ultra-high purity (UHP) semiconductor chamber tool parts cleaning and coatings, UCT’s QuantumClean cleaning division understands the stringent cleaning and micro-contamination specifications of new and recycled parts and provides solutions that improve your process performance and lower your overall cost-of-ownership.
Therefore, QuantumClean focuses on the most critical process areas of wafer fabrication—ALD, CVD, etch, diffusion, PVD.
For ALD, we offer proprietary chemistry that selectively removes deposition, specialized facilities capabilities for large and heavy parts and the employment of ICP-MS and IC analysis techniques. In addition, we have extensive showerhead cleaning expertise and automated optical hole inspection for CVD. Our expertise in etch tool kit cleaning offers minimally abrasive and non-contact processes, plasma re-coating surfaces and coating superior to OEM films and quartz clean recipes that make the quartz less susceptible to process etch. QuantumClean has more quartz, silicon carbide and silicon diffusion parts handling processes, equipment and protocols than all our competitors combined. QuantumClean developed an Environmentally Clean Process for you that eliminates the use of chemicals for Twin Wire Arc Spray (TWAS)/deposit removal. In addition, we offer C-Coat, a proprietary coating that obtains superior performance over traditional TWAS coating on PVD parts.
The benefits of using QuantumClean analytically validated ultra-clean part cleaning and coating services are FASTER chamber recovery, LONGER mean time between cleans, EXTENDED part life, MORE PREDICTABLE chamber start-up and operation and FAST part turnaround times resulting in REDUCED inventory costs.
In addition, most of our competitors only offer recycle chamber parts cleaning. However, we have vast experience in not only process contaminated parts from wafer fabs ("recycled" parts); but, in UHP cleaning of new parts for OEMs and OPMs.