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| Copyright 2007 by Ultra Clean Technology. All Rights Reserved. |
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CRITICAL MATERIALS - GASES |
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| Evaluating the Performance of Digital Mass-Flow Controllers | |||||||||||||
| Mohamed
Saleem and Sowmya Krishna Ultra Clean Technology |
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With the advent of 300-mm and single-wafer processing, the semiconductor industry has placed increasing demands on precise process control and repeatability. One area requiring stringent process control to meet the demands of decreasing device geometries is the delivery of gases to the process tools. Controlling gas delivery, in turn, requires accurate flow control devices such as mass-flow controllers (MFCs). Typically, gas delivery is accomplished by means of an MFC located on a process tool among other gas-delivery components. Most MFCs operate on the principles of heat and mass transfer. Analog MFCs were previously the workhorse of the semiconductor industry. However, despite their widespread use, conventional analog MFCs have limitations in specific areas of gas-flow range. Most analog MFCs become less accurate at flows below 10% of the full-scale flow range. Their accuracy specification is normally a function of full-scale flow, and flow errors are magnified when the MFC operates at less than its specified full-scale flow. Most MFC manufacturers specify accuracy in terms of ±1% of full scale for 2100% flow ranges. For example, an analog MFC rated to perform at 1000 std cm3/min has an error range of ±10 std cm3/min. If the unit operates at a setpoint of 10% (100 std cm3/min), the flow rate is 100 ±10 std cm3/min; in other words, the flow rate has a ±10% error range. The error is further magnified when the MFC operates below a setpoint of 10%. Thus, while the flow accuracy of an analog MFC is about 1% near full scale, it drops several percentage points at low flow rates (<25% of full-scale flow). That loss of accuracy poses repeatability problems at low flow rates, limiting the overall functionality of analog MFCs. Additionally, analog MFCs cannot be reconfigured easily to accommodate changing flow or gas conditions, as required by process engineers in the fab. To avoid the limitations of analog MFCs, digital MFCs are becoming increasingly visible in the semiconductor industry. They enjoy several advantages over analog MFCs, including improved accuracy over a wide range of setpoints (generally ±1% accuracy over a setpoint range of 25100%) and ease of calibration and configuration in multigas/multiflow applications at end-user sites. By means of extensive modeling and gas characterization, MFC manufacturers have been able to develop user-configurable units that permit end-users to program them for virtually any gas or flow rate within a specified boundary.1 That flexibility permits manufacturers to reduce their inventories of MFCs, eliminates recalibration costs arising from configuration changes, and minimizes or eliminates cancellation costs associated with configuration changes. Digital MFCs have become increasingly accurate because they calibrate and store data at multiple points throughout their operating range. Their accuracy specification, based on percent of setpoint as opposed to percent of full scale employed by analog MFCs, leads to improved linearity and accuracy specifications.2 This article discusses the results of an evaluation of several digital MFCs from different manufacturers. Two digital MFCs (a 500std cm3/min N2 unit and a 10std L/min N2 unit) from each manufacturer were tested for particles, moisture drydown time, flow accuracy, and multiflow and multigas capability. While particle performance and moisture drydown characteristics are not directly related to the digital capabilities of MFCs, they are important for understanding how far MFCs have advanced technologically. |
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Test Protocol and Results Particle test data show that nearly all of the MFCs under investigation appeared to be clean during 30 minutes of static testing in N2. However, after undergoing 10 minutes of dynamic testing, a few MFCs exhibited moderate particle shedding. Particle shedding was attributed either to the internal design of the gas-wetted areas of the MFCs or to contamination arising during assembly or packaging. In addition, the MFCs used in this evaluation were test devices; they were not designed to be used in volume production or to be installed in gas boxes. |
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| Moisture Drydown Characteristics Moisture drydown tests were performed using a UG-240A atmospheric pressure ionization mass spectrometer (APIMS) from Hitachi Instruments (Tokyo). The tests were performed on 10-std L/min MFCs only, since the APIMS requires 1.2 std L/min of flow for testing. The MFCs were purged with nitrogen for 1248 hours until their initial moisture level dropped below 1 ppb. To prevent compromising their sensitive electronic circuitry, the MFCs were not baked to remove hydrocarbon contaminants. The units were challenged with 200 ppb of moisture and equilibrated for 20 minutes. Drydown was monitored by switching to zero gas (200-ppt-purity nitrogen), which generated data indicating moisture drydown performance after the device had been subjected to a controlled moisture spike. The tests were performed according to SEMI Standard F58-1000. |
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Flow Verification |
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MFC Multiflow and Multigas Features When the gas-flow range of an analog MFC is changed, the device must be recalibrated. Recalibration involves sending the device to the manufacturer for resizing and testing. The resizing process results in increased turnaround times and added production costs. In contrast, because digital MFCs have multiflow capability, their flow range can be changed simply by changing their flow limits, an operation that can be accomplished during system testing or in the fab. In addition, fab personnel can use one MFC with a variety of gases simply by reconfiguring the device. Most digital MFCs can be programmed to accommodate a range of gases. MFC Multiflow Capabilities. To evaluate the MFCs' multiflow capabilities, the investigators reprogrammed both low-flow (500std cm3/min N2) and high-flow (10std L/min N2) devices using the software provided by the MFC vendors to accommodate the lowest flow rates. The reprogrammed flow rates of the low-flow MFCs ranged from 280 to 325 std cm3/min. For example, one 500std cm3/min MFC was reprogrammed to a new full-scale flow rate of 280 std cm3/min N2. |
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| Figure 3 plots the percentage error versus setpoint for the low-flow MFCs. The figure indicates that the percentage error was largest at the lower setpoints for most MFCs and decreased to within acceptable limits at the higher ones. Less than half of the MFCs tested met accuracy specifications at all setpoints. A few MFCs were out of specification at 25 and 50% setpoints. Most high-flow MFCs, on the other hand, did not meet specifications at any setpoints, although some of them were only ma | |||||||||||||
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| Figure 5 shows an error plot for high-flow MFCs that were tested after being reprogrammed for argon gas. The results were consistent with the results from the as-received and multiflow tests. Only one MFC met accuracy specifications at all setpoints, while the others were outside specifications at nearly all setpoints. That test demonstrated the performance limitations of the MFCs under investigation. | |||||||||||||
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Acknowledgments References |
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| Mohamed Saleem, PhD, is a senior technology development engineer at Ultra Clean Technology (Menlo Park, CA). An active participant in the standards activities of gas-panel, corrosion, surface-analysis, and stainless-steel task forces of SEMI, Saleem has published several papers in the field of materials science and has presented many papers at major conferences. He received an MS in chemical engineering from Tufts University in Medford, MA, and a PhD in materials science and engineering from the University of Florida in Gainesville. (Saleem can be reached at 650/323-4100 or msaleem@uct.com.)
Sowmya Krishnan, PhD, is CTO of Ultra Clean Technology, where she oversees the technology and product development areas for semiconductor gas- and liquid-delivery systems. She has chaired sessions on contamination-free manufacturing and gas delivery at Semicon West, Semicon Southwest, and CleanRooms West. She has also chaired the standards task force at SEMI. She has authored several technical papers and editorials in the fields of microcontamination and semiconductor processing. She received MS and PhD degrees in chemical engineering from Clarkson University in Potsdam, NY. (Krishnan can be reached at 650/323-4100 or skrishnan@uct.com.) |
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