| "Cost Versus Benefit of Fully Integrated Gas Delivery Systems," Semiconductor Fabtech, February 1998, Seventh Edition, February 1998, pp 139-142." Semiconductor Fabtech, February 1998, Seventh Edition, February 1998, pp 139-142.
Abstract: 300 mm wafer processing is dictating new and stringent requirements for processes and process tools. Key design and performance criteria include the reduction of system fottprint and improved cost savings while maintaining current levels of process integrity, reliability, and yield. Process tool manufacturers, subsystems suppliers are investigating innovative ways to meet these challenges. One area that is seeking a revolutionary solution to this requirement is the gas delivery system supplying the process tool through the introduction of the fully integrated gas delivery system (IGDS).
A conventional gas delivery system, supplying a process tool, consists of tubing, components, and interconnects. By contrast, the IGDS consists of component modules mounted on a base block of stainless steel. This system is held together with bolts/screws and seals rather than welded points and tubing interconnects. This article will evaluate the benefits of the fully integrated gas than welded points and tubing interconnects. This article will evaluate the benefits of the fully integrated gas delivery system (IGDS) from a technical and a cost outlook. |
